TM230 Thermal Pad 0.5mm-6mm

Tm230 series thermal conductive silica gel sheet is a high-performance gap filling thermal conductive material, which is mainly used for the transfer interface between electronic equipment and heat sink or product shell. Tm220 series has good viscosity, flexibility, good compression performance and excellent thermal conductivity. So that the air between the electronic components and the heat sink can be completely discharged in use, so as to achieve full contact. The heat dissipation effect is obviously increased. Tm230 series also has a certain degree of viscosity, compared with the ordinary thermal insulation materials, it brings great convenience in the process of product installation, not easy to fall off, easy to operate.

we can do 0.5mm ~5mm thickness .200*400mm in standard size .we can cut 100*100mm 200*200mm ,or different size for customize 

we also can do different color you want 

Features and advantages:

High reliability, high compressibility, softness and elasticity, high thermal conductivity, natural viscosity, no additional surface adhesive, meeting the environmental requirements of RoHS and UL

Application mode:

Filling between circuit board and heat sink

Filling between IC and heat sink or product shell

Applicable products:

Communication equipment / computer / switching power supply / flat panel TV / mobile equipment / video equipment / network products / household appliances / PC server / workstation / optical drive / combo / base amplifier station